張志明 (南海十一郎) 電感寫真集 電感的分類 排除雜訊 訊號處理 電源處理 Applications for High Frequency Chip Inductor The matching coil should be a high-Q type coil to reduce signal losses. It should be a tight inductance tolerance type coil to improve the delay characteristics.A winding type coil is suitable if high Q characteristics are required. A film type coil is suitable if tight inductance tolerance is required. (4) IF SAW Filter Applications for High Frequency Chip Inductor PA The choke coil must have low direct resistance since a large current flows through it.In particular, a 1 A or more current flows through a GSM. Thus, a winding type coil of large rated current is suitable. Recommended Coils Winding WL Series Multilayer CL Series A multi-layer type coil is generally used.A thin film type coil is suitable if tight inductance tolerance is required. Recommended Coils Multilayer CL Series Film AL Series (5) Process Flow Cutting Isostatic Press Printing Tape Casting Plating Termination Tumbling Sintering Binder Burn Off Taping Visual Inspection Sorting FQC Shipping Mixing 積層印刷式陶瓷高頻電感製程 Mixing Powder and binder etc. were mixed in ball mill to make a slurry Tape Casting Slurry was pumped from a pressure-tank, flow under the doctor blade, dry in the oven,and become a dry tape (foil) Printing Print the electrode and ceramic paste on the bottom cover to make turns. Iso-static Press and Cutting Press the printed bar with cover to become one piece of bar Cut the bar into pieces. Binder Burn off , Sinter and Tumbling Binder Burn Off: Burn off the organic binder。 Sinter: Sinter the chip to become a dense , strong body。 Tumbling: To de-burr and round the corner。. Termination Connect the internal electrode with external silver electrode。 ExternalElectrode InternalElectrode Plating Same as Left Side Sn Ni Cu Ag Plate the Copper, Nickel and Tin to make the chip solderable Sorting and Visual Inspe
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