三维高密度组装技术的发展及新成果.docVIP

课 题： 三维高密度组装技术的发展 及新成果 院 （系） 专 业： 学生姓名： 学 号： 三维高密度组装技术的发展及新成果 XXX （桂林电子科技大学 机电工程学院，广西 桂林 541004） 摘 要：三维高密度封装技术是一种可实现电子产品小尺寸、轻重量、低功耗、高性能和低成本的先进封装技术，该技术已广泛用于手机、数码相机、MP4及其他的便携式无线产品, 是微电子学领域的一项重大变革技术，对现代化的计算机、自动化、通讯业等领域将产生重大影响。随着人们对手持式电子设备不断提出的微型化、多功能化和集成化的需求，转化为采用三维（3D）方式装配印制电路板（PCB）强大推动力。为满足电子产品轻、薄、小以及系统集成的需求,各种新的封装结构正在不断推出. 三维封装(3D packages)愈来愈受到重视。本文概述了三维高密度组装思想在芯片封装领域的应用。 关键词：三维组装技术；3D-MCM；PIP；PoP；TSV；高密度封装；芯片堆叠 Three-dimensional high-density assembly technology development and new achievements ????????????????????????????????????????? XXX (School of Mechanical and Electrical Engineering of the Guilin University of Electronic Technology , Guilin, Guangxi 541004,China) Abstract: Three-dimensional high-density packaging technology is an enabling electronic products small size, light weight, low power consumption, high performance and low cost advanced packaging technology, which has been widely used in mobile phones, digital cameras, MP4 and other portable wireless products, is a major field of microelectronics revolution technology, the modern computer, automation, communications and other areas will have a significant impact. As people continue to raise handheld electronic device miniaturization, multi-functional and integration requirements, into a three-dimensional (3D) mode assembled printed circuit board (PCB) a strong force. Electronic products to meet the light, thin, small, and system integration requirements, a variety of new packaging structure is being constantly introduced. Dimensional package (3D packages) more and more attention. This article outlines the three-dimensional high-density chip package assembly of thought in the field of application. Key words: three-dime