PCB流程教育训练-Final.pptxVIP

流程說明 (Process Description);; ;;內層影像顯影 Developing;蝕刻：蝕刻液的化學成份、溫度、氯化銅 pH 值及輸送速度等，皆會對光阻膜的性能造成考驗。;內 層 Inner layer;內 層 Inner layer;;;; 外層鑽孔(1) Outer Layer Drilling;以內層定位孔為基準座標鑽出外層相對位置的各種孔徑; 鍍通孔 (PTH) (Plated Through Hole) ; 鍍通孔(PTH) Plated Through Hole; 鍍通孔(一次銅) (Plated Through Hole) ;;流程說明 (Process Description);;流程說明 (Process Description);流程說明 (Process Description);;流程說明 (Process Description);;;;測試　Open/Short Test;總 檢 Final Inspection