集成电路的基本制造工艺1.pptxVIP

集成电路原理与制造工艺;2019/11/15;2019/11/15;2019/11/15;2019/11/15;2019/11/15;2019/11/15;2019/11/15;2019/11/15;2019/11/15;IC产业流程图;IC制造流程;IC设计;IC制造;IC封测;2019/11/15;净化厂房;芯片制造净化区域走廊;2019/11/15;Here in the Fab Two Photolithography area we see one of our 200mm 0.35 micron I-Line Steppers. this stepper can image and align both 6 8 inch wafers. ;Here we see a technician loading 300mm wafers into the SemiTool. The wafers are in a 13 wafer Teflon cassette co-designed by Process Specialties and SemiTool in 1995. Again these are the worlds first 300mm wet process cassettes (that can be spin rinse dried). ;As we lo