COB封装对LED光学性能影响的研究.docVIP

- 6 - COB封装对LED光学性能影响的研究 祁姝琪1,丁申冬2,郑　鹏1,秦会斌1 (1.杭州电子科技大学新型电子器件与应用研究所,杭州 310018; 2.浙江古越龙山电子科技发展有限公司,浙江 绍兴 312000 摘　要:针对LED高光效、低功耗的要求,文章在分析LED光学性能的基础上,采用了COB(Chip On Board即板上芯片封装技术。研究了不同封装工艺和材料,分析比较其对LED光通量、光效和色温的影响。研究首先介绍COB封装的结构、优点及其实用性,然后分析影响LED光学性能的因素,最后进行测试。在实验过程中,发现COB封装结构除了具有保护芯片的功能外,还可以提高出光效率,并实现特定的光学分布。实验结果表明:文章提出的封装工艺对于提高光通量和光效、调节色温有良好的效果。 关键词:COB;光学性能;LED 中图分类号:TN305.94文献标识码:A 文章编号:1681-1070(201203-0006-04 Research of the Effect on the LED Optical Performance from COB Packaging QI Shu-qi1, DING Shen-dong2, ZHENG Peng1, QIN Hui-bin1 (1.Institute of New Electron Device Application, Hangzhou Dianzi University, Hangzhou 310018, China; 2. ZJGuYue LongShan Electronic Technology Development Co., Ltd., Shaoxing 312000, China Abstract: In this paper, the COB (Chip On Board packaging technology is adopted in LED products to meet the requirements of high efficiency and low power dissipation. The optical features of LEDs are analyzed first. Subsequently, different packaging technology and materials are introduced to make a comparison between each others effects on the ? ux, luminous ef? ciency and color temperature. Finally, the COB packaging technology is presented. After the introduction of its structure, advantages and practical utility, experiments are conducted. The experimental results show that the COB packaging not only has the capability of protecting the LED chips, but improves the ef? ciency and achieves speci? c optical distribution. Consequently, the proposed packaging technique achieves an increase on the luminous efficiency and adjusting of color temperature. Key words: COB; optical performance; LED 收稿日期:2012-01-09 1 引言 随着LED尤其是高亮度LED的发展,对LED芯片封装技术的要求越来越高,技术难度也越来越大。封装是构成LED的重要组成部分,虽然LED的封装与半导体类的分立元件的封装大体一样,具有保护芯片不受外界环境影响和提高导热散热能力等功能。不过LED的封装还具有特殊性,它更重要的作用是提高出光效率,并实现特定的光学分布,输出可见 0755-******** 第12卷第3期- 7 - 光。由此可知,LED 封装除了电学参数之外,还需要对光学参数进行专门设计。根据不同的应用场合,LED 芯片可以通过多种封装方式形成不同结构和外观的器件,如引脚式封装、表面贴装封装和多芯片集成封装等。当前国内外大多采用表面贴装封装的方式,相比于引脚式封装,其具有轻薄短小的特点,但是在应用中存在散热、