5G无线系统的电-热仿真.pdfVIP

Electro-Thermal Simulation for 5G Wireless Systems David Geb Application Engineer 1 Outline • Introduction Design Challenges in 5G Wireless Systems ‐ Thermal concerns • ANSYS Thermal Modeling Solutions ‐ Coupled electro-thermal modeling 37 ~ 40 GHz 8x8 phased array for 5G base station ➢ ANSYS Electronics Desktop Platform ‐ Chip-Package-System (CPS) thermal modeling • Electro-Thermal Simulation Case Study ‐ 5G Smartphone RF-Antenna System 2 5G mobile device RF-antenna system Introduction Design Challenges in 5G Wireless Systems 3 Introduction Design Challenges in 5G Wireless Systems • 5G launch is approaching • Why 5G? ‐ Higher bandwidths (available at higher frequencies) ‐ Many of these frequency ranges are largely untapped in terms of current wireless traffic (avoid overcrowding and interference issues ) • Major Challenges: ‐ Smaller physical size scales, shorter wavelengths, higher design sensitivities ‐ Temperature impact becomes significant ‐ Larger electromagnetic losses ‐ Difficult-to-characterize frequency dependence of material properties ‐ More pronounced wave effects of the EM fields at smaller wavelengths 4 ANSYS Thermal Modeling Solutions 5 ANSYS Thermal Modeling Solutions • ANSYS offers thermal modeling solutions that span different applications. • ANSYS Icepak is an electronics cooling solution for IC packages, printed circuit boards and complete electronic systems IC package thermal management Thermal management for wearables Data center thermal management 6 Electro-Thermal Solutions •Thermal analysis