载板制程封装介绍[宣讲].ppt

Compounds of EMCs Used in Packages 說明: T.C: Thermal Conductivity M.A: Moisture Absorption Measurement of Compound Properties ＊Flowability * Spiral Flow * Kokashiki Viscosity * Laboplasttmill Torque * Cone-Plate Viscometer ＊ Filling ability ( Gelled Particle ) * Acetone Insoluble Content ＊Cureability * Gel Time * Curelastmeter Torque * Laboplastmill Stable time * Hot Hardness Spiral Flow / Flowability ＊Mold Condition * Sample Powder * Mold Temp. 1