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- 约1.1万字
- 约 15页
- 2021-01-13 发布于辽宁
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SMD: Surface Mou nt Devices/ 表面贴装元件
SOT Small outli ne tran sistor/ 小外形晶体管
SOD Small outli ne diode/ 小外形二极管
SOIC: Small outli ne In tegrated Circuits/ 小外形集成电路
SSOIC: Shrink Small Outli ne In tegrated Circuits/ 缩小外形集成电路
SOP: Small Outli ne Package In tegrated Circuits/ 小外形圭寸装集成电路
SSOP: Shrink Small Outli ne Package In tegrated Circuits/ 缩小外形圭寸装集
成电路
TSOP: Thin Small Outli ne Package/ 薄小外形圭寸装
TSSOP: Thin Shri nk Small Outli ne Package/ 薄缩小外形圭寸装
SOJ: Small outli ne In tegrated Circuits with J Leads/ “ J” 形引脚小外
形集成电路
PQFP Plastic Quad Flat Pack/ 塑料方形扁平封装
SQFP Shrink Quad Flat Pack/ 缩小方形扁平封装
CQFP C
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