ict测试原理及程式简介.pptVIP

ICT測試原理及程式簡介;一.ICT的功能;二. ICT的硬件結構 ;公司: TRI (Test Research Inc.)德律科技 產地: 台灣;TRI 8001測試畫面;公司: TRI (Test Research Inc.)德律科技 產地: 台灣;TRI 518測試操作畫面;相匹配的治具簡介; 相匹配的治具必需為真空治具, 即治具下壓的動力為真空. 真空治具根據繞線長度分為: 長線治具,短線治具和無線治具. 我們現在使用的治具為長線治具. 治具內部結構如下:;;;;Interface;Introduction of Agilent 3070 ;Agilent 3070 Family;Anatomy of the Agilent Medalist 3070; Agilent3070 測試畫面;Anatomy of the Agilent Medalist i3070 Fixture;Anatomy of the Agilent Medalist 3070;Fixture Numbering; Anatomy of the Agilent Medalist 3070 The Module Control Cards The Analog Stimulus - Response Unit (ASRU);ASRU Card;Module Control Card;;Hybrid 32 Card;ICT TEST程式与夾具命名規則;MHS机种为例：;三. ICT的基本測試原理;source: ;An Overview of 3070 Test;Part 3;Pins测试概述;Pins Test;;Pins Test Called from testplan;Pins测试的调试;Part 4;Shorts Test overview;Shorts Test;Expected Shorts;;;;假象短路的调试;Shorts Test - Report Options;Part 5;Part 6;The VTEP/iVTEP/TestJet Test;TestJet测试能力的极限值为20fF，VTEP测试能力的极限值为5fF。 低于5的值使用iVTEP来进行测试，但是iVTEP的测试速度比较慢，而且不能用来测试连接器。;The VTEP/TestJet Verification;The TestJet Test;Turn On AutoDebug for iVTEP + VTEP;AutoDebug calculates the threshold limit ;The TestJet Test - After Debug;Part 10;Typical IC with Boundary-Scan;Basic Test of IC with Boundary-Scan;The Boundary-Scan Test Development Process ;Typical IC with Boundary-Scan; Thank you!