smt焊膏质量与测试焊.docxVIP

Document serial number【KKGB-LBS98YT-BS8CB-BSUT-BST108】 Document serial number【KKGB-LBS98YT-BS8CB-BSUT-BST108】 SMT焊膏质量与测试焊 焊膏质量与测试焊 摘  要：随着电子封装向高性能、高密度、微型化的发展，焊膏材料和技术显得极为重要。本文讨论了表面安装技术（SMT）焊膏的焊粉质量、焊剂载体要求以及焊膏的基本性能测试。SMT焊膏质量与测试 关键词：焊膏、焊粉、焊剂载体 The Quality and Testing of Solder Paste for SMT Abstract: Because of the development of high density, high performance and miniaturization in electronic packaging, solder paste material and technology become more and more important. This paper discussed the quality of SMT solder paste, including powder pr