BGA封装工艺简介.pptx

Introduction of BGA Assembly ProcessBGA 封装工艺简介;BGA Package Structure;Typical Assembly Process Flow;FOL– Front of Line前段工艺;FOL– Front of Line Wafer;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Optical Inspection;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;;FOL– Epoxy Cure 银浆固化，检验;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL–Optical Inspection 检查;;Material Problem;;;;;;; 2nd Bond Fail ( II ); Looping Fail(Wire Short I);Looping Fail(Wire Short II);Looping Fail(Wire Short III);EOL– End of Line后段工艺;EOL– Molding（注塑）;EOL– Molding（注塑）;EOL– Molding（注塑）;EOL– Molding（注塑）; EOL– Molding（注塑）;EOL– Post Mold Cure（模后固化）;EOL– Laser Mark（激光打字）;EOL– Ball Attach 植球;EOL– Ball Attach 植球;EOL– Ball Attach 植球;;Ball REFLOW 参数;REFLOW PROFILE;EOL– Singulation;EOL– Singulation;EOL– Singulation ;EOL– Test 测试;EOL– Final Visual Inspection（终检）;EOL– Packing 包装;The End Thank You！ ;1、Genius only means hard-working all ones life. (Mendeleyer, Russian Chemist)? 天才只意味着终身不懈的努力。20.8.58.5.202011:0311:03:10Aug-2011:03 2、Our destiny offers not only the cup of despair, but the chalice of opportunity. (Richard Nixon, American President )命运给予我们的不是失望之酒，而是机会之杯。二〇二〇年八月五日2020年8月5日星期三 3、Patience is bitter, but its fruit is sweet. (Jean Jacques Rousseau , French thinker)忍耐是痛苦的，但它的果实是甜蜜的。11:038.5.202011:038.5.202011:0311:03:108.5.202011:038.5.2020 4、All that you do, do with your might; things done by halves are never done right. ----R.H. Stoddard, American poet做一切事都应尽力而为，半途而废永远不行8.5.20208.5.202011:0311:0311:03:1011:03:10 5、You have to believe in yourself. Thats the secret of success. ----Charles Chaplin人必须相信自己，这是成功的秘诀。-Wednesday, August 5, 2020August 20Wednesday, August 5, 20208/5/2020 6、Almost any situation---good or bad---is affected by the attitude we bring to. ----Lucius Annaus Seneca差不多任何一种处境---无论是好是坏---都受到我们对待处境态度的影响。11时3分11时3分5-Aug-208.5