SMT缺陷及防范措施概述.pptxVIP

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  • 约5.71千字
  • 约 42页
  • 2021-06-02 发布于河北
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SMT defects and countermeasure SMT缺陷及防范措施 ;Identify SMT defects;Major contributor to defects 缺陷的主要分布; Know the common defect 了解常见缺陷类型 Analysize the possible cause 分析可能的原因 Countermeasure for the defects 基于以上原因采取的对策 ;? Chip components standing on a terminal end (tombstoning). 片式元件末端翘起(墓碑);Countermeasure/ 对策 Mechanism: Surface tension in component terminal is uneven in reflow. 原理:在回流过程中零件两末端的表面张力不均衡. 1. Component terminal heat distributed unevenly 零件两末端受热分布不均衡. Insufficient soak time: Reflow profile optimization. 保温区时间太短:优化回流曲线参数. 2. PCB Pad design issue (the p

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