第二章CMOS制备基本流程.pptxVIP

2.1 CMOS制造工艺流程简介 ;Stages of IC Fabrication;? In the simplest CMOS technologies, we need to realize simply NMOS and PMOS transistors for circuits like those illustrated below.;PMOS and NMOS wafer cross section after fabrication;? ? ? ? ? ? ? ?;;? Photolithography - Mask #1 pattern alignment and UV exposure - Rinse away non-pattern PR - Dry etch the Nitride layer -- Plasma etch with Fluorine CF4 or NF4 Plasma - Strip Photoresist (H2SO4或O2 plasma);? Wet Oxide (thick SiO2) - H2O (≈ 500 nm, 90 min. @1000oC);;;? Thermal Anneal (热退火) - Repair crystal lattice structure damage due to implantation;? Photolithography - Mask #4 pattern alignment and UV exposure - Rinse away non-pattern PR;Threshold Adjustment, N-type PMOS;;;? Photolithography - Mask #6 pattern alignment and UV exposure;目标：;LDD:;? Photolithography ? Mask #8 pattern alignment;SiO2 隔离介质层;? Photolithography;? Screen Oxide Growth ? Thin SiO2 layer ~10 nm to scatter the implanted ions;? Photolithography;? N+ and P+ Drive-in;2.7 接触与局部互联的形成;? HF etch to remove thin SiO2 ? Remove screen oxide from drain, source and ploy gate regions ? Dip (浸) for a few seconds with HF; Titanium Deposition;? Photolithography ? Mask #11 pattern alignment and UV exposure ? Rinse away non-pattern PR;;? Photolithography ? Mask #12 pattern alignment and UV exposure; Via Deposition – Tungsten Plugs (插头);; ? Strip Photoresist; Multiple Metal Layers;Intel μprocessor chip;Summary of Key ideas;作业：MEMS 器件制备;9、春去春又回，新桃换旧符。在那桃花盛开的地方，在这醉人芬芳的季节，愿你生活像春天一样阳光，心情像桃花一样美丽，日子像桃子一样甜蜜。11月-2011月-20Thursday, November 19, 2020 10、人的志向通常和他们的能力成正比例。02:35:0602:35:0602:3511/19/2020 2:35:06 AM 11、夫学须志也，才须学也，非学无以广才，非志无以成学。11月-2002:35:0602:35Nov-2019-Nov-20 12、越是无能的人，越喜欢挑剔别人的错儿。02:35:0602:35:0602:35Thursday, November 19, 2020 13、志不立，天下无可成之事。11月-2011月-2002:35:0602:35:06November 19, 2020 14、Thank you very much for taking me with you on that splendid outing to Londo