文本课件教程封装知识hga optimize por solder.pptxVIP

HGA Optimize Solder Composition —— low Ag Kang WangGPE-1 2011 July Ⅰ. Failure Situation Introduction * Process: 50μm M705 solder with J-SBB * Phenomena： In the drop test ，cracks can be found in the as-solidified joints as well as the joints under thermal shock . Ⅰ. Failure Situation Introduction* Reasons: M705 solder has high hardness and modulus but low elongation.This is due to the inherent brittle nature of the IMC, defects within or at IMC interfaces or transfer of stress to the interfaces as a result of the low ductility of the bulk solder. Ⅱ. Current Situatio