功率型LED芯片的热超声倒装技术.pdfVIP

DOI :10.13290/ki .bdtjs.2007.04.021 封装、测试与设备 Packag ,T st and Equipm nt 功率型LED 芯片的热超声倒装技术 1 1 1, 2 1 3 3 1 李艳玲, 牛萍娟 , 郭维廉 , 刘宏伟, 贾海强, 陈弘, 胡海蓉 (1.天津工业大学 信息与通信工程学院, 天津300160;2.天津大学 子信息工程学院, 天津300072; 3.中国科学院物理所, 北京100080) 摘要:结合功率型GaN 基蓝光LED 芯片的电极分布, 在硅载体上电镀制作了金凸点, 然后 通过 超声倒装焊接技术将LED 芯片焊接到载体硅片上。结果表明, 在合适的 超声参数范围 内, 焊接后的功率型LED 光电特性和出光 一致性较好, 证明了 超声倒装焊接技术是一种可靠 有效的功率型光电子器件互连技术。 关键词:功率型发光二极管; 超声;倒装焊;金凸点 中图分类号:TN365;TN405.97 　　文献标识码:A 　　文章编号:1003-353X (2007)04-354-04 Thermosonic Flip Chip Bongding for Power LED Chips 1 1 1, 2 1 3 LI Yan-ling , NIU Ping-juan , GUO W i-lian , LIU Hong-w i , JIA Hai-qiang , 3 1 CHEN Hong , HU Hai-rong (1.School of Inf ormation Communication Engineering, Tianjin Polytechnic University, Tianjin 300160, China; 2.School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China; 3.Institute of Physics, ChineseAcademy of Sciences, Beijing 100080, China) Abstract:Bas d on th distribution of l ctrod s for pow r GaN blu LED chip, Au bumps on Si w r fabricat d by l ctroplating, and th n th LED chips w r w ld d to Si carri r by th rmosonic FCB.Th r sults indicat that th optic and l ctric charact ristics as w ll as th light xtraction uniformity of pow r LED aft r th rmosonic FCB ar fin as long as th h at and ultrasonic param t rs ar within a suitabl rang . Th rmosonic flip chip bonding is a r liabl and ffici nt conn ction t chniqu for pow r opto l ctronic d vic s. Key words:pow r light mitting diod ;th rmosonic;flip chip bonding;Au bump