热超声倒装键合中温度对对准精度的影响.pdfVIP

DOI:10.16526/ki.11-4762/tp.2009.04.033 计算机测量与控制 ( ) .2009.17 4 设计与应用 Computer Measurement Control · 757 · 文章编号：1671-4598 （2009）04-0757-03 中图分类号：TP391.41 文献标识码：A 热超声倒装键合中温度对对准精度的影响 张丽娜，韩 雷 （中南大学 现代复杂装备设计与极端制造教育部重点实验室，湖南 长沙 410083） 摘要 ：针对热超声倒装键合过程中芯片与基板的对准精度受温度影响，采用了 6 参数仿射模型分层搜索算法分别研究了温度影响下序列图像 间平移、伸缩、旋转参数的分布规律；分析结果显示，随着温度的升高，湍流强度增强，图像间平移、伸缩、旋转运动越剧烈，对应参数的离散 程度也越高；在键合温度下，伸缩与旋转对对准精度影响不大，可以忽略；平移最大可达 6 个像素，必须将平移量控制在亚像素级范围内才能满 足芯片与基板的对准精度要求。 关键词：热超声倒装键合；仿射变换；分层搜索；清晰度评价函数 Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding Zhang Lina, Han Lei (State Key Laboratory of Modern Complex Equipment Design and Extreme manufacturing Central South University, Changsha 410083, China) Abstract: As the temperature will effect the alignment accuracy of the chips and substrates in the process of chips package, the parameters distribution regulation of translation, scale and rotation of sequence images under the influence of the temperature are respectively studied by 6-parameter affine model hierarchical search algorithm. By Analysis of the experimental results, it indicated that the higher the temperature,the intensity of turbulence becomes bigger,and the motions of translation, scale and rotation more intensive and the dispersion degree of translation, scale and rotation are much higher. At the working temperature,the influence of s