热超声倒装键合界面的运动传递过程.pdfVIP

第 44 卷第 2 期 机 械 工 程 学 报 Vol.44 No. 2 2008 年 2 月 CHINESE JOURNAL OF MECHANICAL ENGINEERING Feb. 2008 热超声倒装键合界面的运动传递过程* 王福亮 李军辉 韩 雷 钟 掘 (中南大学机电工程学院 长沙 410083) 摘要：采用改进的激光多普勒振动测量系统，获得小直径激光斑，解决了大量数据采集和分析、同步触发等技术问题，实时 精密测量热超声倒装键合过程中工具和芯片的运动。通过分析运动曲线，发现“速度分离”是表征键合过程状态改变的重要 临界现象；发现在“速度分离”前工具／芯片粘着在一起运动，之后它们间是“粘滑”交替的过程；在“速度分离”后的运 动过程中，工具能量一部分通过芯片传递到键合界面，形成键合强度；另一部分消耗在芯片／工具间的摩擦上，磨损芯片和 工具，损害键合界面结构和强度。根据研究结果提出了新的超声加载过程思路，以期减小磨损，提高键合强度。 关键词：热超声倒装键合 运动传递 振动监测 激光多普勒测振 + 中图分类号：TN911.6 TG453 .9 Viration Transfer Process at Thermosonic Flip Chip Bond Interface WANG Fuliang LI Junhui HAN Lei ZHONG Jue (School of Mechanical and Electronical Engineering, Central South University, Changsha 410083) Abstract ：A laser Doppler vibration (LDV) measurement system was setup to monitor the real time vibration of bonding tool and flip chip in thermosonic flip chip bonding. By analyzing the vibration of chip and comparing with the vibration of tool tip, the “stall” phenomena of chip is elucidate, which is significant critical phenomena indicating bonding states changing during bonding process. Stall means that the initial bonding strength is formed at the bonding interface. The chip was vibrated with tool tip before “stall”. After “stall”, relative movement produced between them, a part of tool energy is propagated to the bonding interface via chip and formed bonding strength, and a part of energy is consumed at the tool/chip interface friction, which caused damage to bonding strength and bonding interface structure, caused damage on the surface of chip and tool. Finally, a novel bonding parameter apply method is developed to reduce the friction and to enhance the bonding strength. Key words ：Thermosonic flip chip