焊线及焊线工艺介绍.pptxVIP

WIRE BOND PROCESS INTRODUCTION;;;;;GLASS;;;;;;;;;;;;;Free air ball is captured in the chamfer;Free air ball is captured in the chamfer;Free air ball is captured in the chamfer;Free air ball is captured in the chamfer;Formation of a first bond;Formation of a first bond;Formation of a first bondContact ;Formation of a first bondBase ;Capillary rises to loop height position;Capillary rises to loop height position;Capillary rises to loop height position;Capillary rises to loop height position;Capillary rises to loop height position;Capillary rises to loop height position;Formation of a loop;Formation of a loop;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;CAPILLARY (III);;;;;;;;;;;;;;Material Problem;;;;;;;;;; 2nd Bond Fail ( II ); Looping Fail(Wire Short I);Looping Fail(Wire Short II);Looping Fail(Wire Short III);