半导体封装过程集成质量信息系统研究.docxVIP

PAGE PAGE 7 * Email: Shuguanghe@126.com 国家自然科学基金（No和天津市科技攻关计划（No）资助. 半导体封装过程集成质量信息系统研究 何曙光*,1，齐二石1，李莉2 (1.天津大学管理学院，天津 300072；2. 天津职业大学电信工程学院，天津 300403) 摘要：在对半导体封装过程进行深入分析的基础上，提出了基于产品，原材料，规格和设备的静态集成模型、基于工单和工序的数据集成模型以及基于中央数据库的质量工具集成模型，这些质量工具包括统计过程控制(SPC, Statistical Quality Control)、试验设计(DOE, Design of Experiments)以及测量系统分析(MSA, Measurement System Analysis)等。以上述模型为基础建立了半导体封装集成质量信息系统的体系结构。通过该体系架构，可以实现原始质量数据和质量分析、控制及改进工具的有效集成。最后基于SQL Server2000和VS.net实现了一个原型系统。 关键词：半导体封装；集成质量信息系统；集成模型；原型系统 Study on the Integrated Quality Information System of Semiconductor Assembly Processes HE Shuguang*,1 QI Ershi1 LI Li2 (1. School of Management, Tianjin University, Tianjin 300072, China; 2. School of Electronics and Information Engineering, Tianjin Professional College, Tianjin 300402, China ) Abstract: Based on the study of the processes of semiconductor assembly, three integration models were put forward. One is a static integration model based on the products, materials, specifications and devices. The other is a dynamic model based on the manufacturing orders and the manufacturing processes. The third one is an integration model of all kinds of quality tools based a central database. And these quality tools include SPC (Statistical Process Control), Design of Experiment (DOE), MSA (Measurement System Analysis), etc. Based on these models, a framework of an integrated quality information system for semiconductor assembly was studied. Through this framework, quality raw data, manufacturing processes and the quality tool set can be integrated effectively. At last, a prototype was developed based on SQL Server2000 and Microsoft VS.net. Key words: Semiconductor Assembly, Integrated quality information systems, Integration model, prototype 1 引言 作为电子信息产业的重要支柱之一，半导体及相关产业在我国具有巨大的发展潜力。随着全球产业链的调整，欧美、日韩及台湾地区的半导体制造、封装及测试企业纷纷向中国大陆转移，未来几年内我国的半导体相关产业必将蓬勃发展。半导体封装和测试是连接上游晶片制造商和下游电子产品制造商的中间环节，在半导体产业链中具有重要的地位。相对于半导体产业链上游的晶片制造而言，半导体封装和测试