芯片制造介绍.pptx

会计学;;To make wafers, polycrystalline silicon is melted. The melted silicon is used to grow silicon crystals (or ingots) that are sliced into wafers. 首先融化多晶硅，生成晶柱，然后切割成晶圆。;To remove the tiniest scratches and impurities, one side of each wafer is polished to a mirror-like surface. Chips are built on this surface. 切下的晶圆要经过清洁、磨光等步骤以去除杂质，使平面光滑。;A layer of silicon dioxide (SiO2) glass is grown on the wafer by exposing the wafer to oxygen at very high temperatures. A process called chemical vapor deposition (CVD) is then used to coat silicon dioxide onto the wafer surface. Because it will not conduct electricity, this layer is called “dielectric”. Later, channels will be etched or otherwise formed in the dielectric for conducting materials. SiO2 may also be grown or deposited during later steps in the process as layers of the circuit are built onto the chips: 制作晶片的第一步是在晶圆上沉积一层不导电的二氧化硅。在晶片的后续制作过程中，二氧化硅层的成长、沉积会进行很多次。 在高温下使晶圆曝氧可以使二氧化硅层成长。然后使用化学气相沉积方法使二氧化硅层沉积在晶圆表面。;What is microlithography?;Photolithography, or lithography for short, is used to create multiple layers of circuit patterns on a chip. First, the wafer is coated with a light-sensitive chemical called photoresist. Then light is shone through a patterned plate called a mask or reticle to expose the resist—much the same way film is exposed to light to form a photographic image. 下面使用光刻制程在芯片建立多层电路图案。 首先，晶圆表面上覆盖上一层感光性强的化学制品光刻胶。象光透过电影底片形成图象一样，光透过光掩膜在晶圆上形成图案。;The wafers exposure to light in lithography causes portions of the resist to “harden” (or become resistant to certain chemicals). The “non-hardened” resist is washed away. Then the material below it, for example SiO2, is etched away. Finally, the “hardened” resist is stripped off so that the material underneath forms a three-dimensional pattern on the wafer. The first lithography and etch process will result in a pattern of SiO2. 光刻制程后，感光部分的光刻胶具有强的抗腐蚀性，抗腐蚀性 弱的光刻胶在接下来的制程里被洗去。接着光刻胶下面???部分 被蚀刻制程除去。最后，抗腐蚀性强的光刻胶也被剥离。 光刻与蚀刻制程在晶圆表面形成3D的图案。;Through several lithography and e