详细的笔记本电脑检验规范.docx

可编辑 精品 Engineering Directive (ED) Engineering Specification (ES) Manufacturing System (MS) Subject:Sub-Assembly General Inspection Spec. Subject: Description: 成型品/组立件变形量之检验规范 铜钉/卯钉之检验规范 热熔件之检验规范 电镀/导电漆之检验规范 EMI 弹片高度及测试规范 组立件之一般位置及公差 螺丝锁附扭力与防松脱扭力规范 Doc. No.: 814-R001 Release Date: Jun., 10, 2003 Rev.: 1 Revision Status Page Rev. Reason For Change: Update 814-R001 – 1. From Acer logo to Wistron logo – 2. Remove cosmetics spec. from this document – 3. Update 变形量之检验规范 – 4. Update 电镀/导电漆之检验规范 Copy To(All Contents):AIH, DC, MNT0 Copy (Cover Sheet): 可编辑