SJT 10175-1991半导体集成电路多层陶瓷双列直插外壳详细规范.pdf

L 55SJ中华人民共和国电子工业行业标准SJ/T 10175-91半导体集成电路外壳详细规范()1991-12-01实施1991-05-28发布中华人民共和国机械电子工业部发布 中华人民共和国电子工业行业标准半导体集成电路多层陶瓷双列直插外壳详细规范SJ/T 1017591Detail specification of multilayerceramic dual in-line package for semiconductor integrated circuits本规范规定了半导体集成电路多层陶瓷双列直插外壳(D型)质量评定的全部内容。本规范符合GB6649《半导体集成电路外壳总规范》的要求。1991-12-01实施中华人民共和国机械电子工业部1991-05-28批准1 SJ/T 10175-91中华人民共和国机械电子工业部GB 11493评定外壳质量的依据：GB6649《半导体集成电路外壳总规SJ/T 10175—91范》多层陶瓷双列直插外壳(D型)详细规范订货资料：见本规范第7章。22简要说明机械说明1主要材料外形依据：外引线、焊接环及盖板：定膨胀合金GB7092《半导体集成电路外形尺寸》。（4J29或4J42)结构图、零部件图：见本规范第4章。陶瓷基体;95%Al20：陶瓷引出端识别标志：见本规范第4.2条。封盖方法外壳表面镀涂：底座及盖板应镀镍、金。焊料熔封或平行缝焊质量评定类别2I、1、I类2 SJ/T 10175--914外壳结构与尺寸4.1外壳系列编号mmTMD,D2M2DsMsDmaxMmax2e型D08S2-014.802.406.604. 208.406.0010.167. 627. 627.37D08S2-025.103.407. 005.108.806.9010.167.627.627.37D14S2-014.802.406.604.208.406.0017.787. 627. 627.37D14S2-025.103.407.005.108.806.9017.787.627.627.37D14S2-035.004.007. 005.608.807.2017.787.627.627.37D16S2-015.103.407.005.108.806. 9020.327.627.627.37D16S2-025.004.007.005.608.807.2020.327. 627.627. 37D18S2-015.103.407.005.108.806.9022.867. 627.627.37D18S2-025.004.007.005.608.807.2022.867.627. 627.37D18M2-035.505. 007.206.809. 308.8022.8610.1610.169.91D20S2-015.103.407.005.108.806.9025.407. 627.627.37D20M2-025.505.007.206.809. 308.8025.4010.1610.169.91D22M2-015.505.007.206.809.308.8027.9410.1610.169.91D24M2-015.505.007. 206.809.308.8030.4810.1610.169.91D24L2-025.505. 507.507.509.509.5030.4815.2415.2414.99D24L2-036.406.408.408.4010.8010.8030.4815.2415.2414.99D24L2-047.507.5010.0010.0012.0012.0030.4815.2415.2414.99D28L2-016.406.408.408.4010.8010.8035.5615.2415.2414.99D28L2-0211.004.0013.006.0017.0010.0035.5615.2415.2414.99D40L2-017.007.009.009.0011.1011.1050.8015.2415.2414.99D40L2-028.008.0012.0010.0014.0012.0050.8015.2415.2414.99D42L2-017. 007. 009. 009.0011.1011.1053.-3415.2415.2414. 99D48L2-0110.008.0012.0010.0014.0012.0060.9615.2415.2414.994.2外壳结构和各部位的尺寸外壳结构和各部位的尺寸如图1～图4所示，并符合4.1条的规定。所有尺寸公差除各图中注明者外，陶瓷部分按GB4069《电子陶瓷零件公差》6级精度计算，金属部分按GB1804《公差与配合未注公差尺寸的极限偏差》I