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- 2024-02-04 发布于江苏
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SOPASSEMBLYPROCESSFLOWQUALITYCONTROLINSTRUCTION2023最新整理收集do
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ContentsPackageInstructionProcessFlowQualityControl
PackageInstructionSOPSSOP3.TSSOP4.MFPASEASE
PackageInstruction
ASYprocessflowWaferSawDieAttachWireBondWaferMountWaferGrindingEpoxyCureMoldingPostMoldCurePlatingTrim/FormPackingShippingDe-junkLaserMarking前段制程后段制程WaferDie(chip)DieonLeadframeEpoxyLeadFrameBeforeAfterLaserMarkingLaserMarkingLaserMarkingLaserMarking
WaferGrindingLOADUNLOADGRINGINGPurpose:GrindingthewafertoCustomerrequiredthicknessWaferGrinding晶圓(未研磨)研磨機晶圓(研磨後)
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