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基于机器视觉的SMD共面性检测技术研究与应用
Abstract
IntheproductionprocessofPCBsurfacemounting,processdefectsoccurinSMDdue
tosecondaryscreening,transportation,formingandotherfactors.Inordertoensurethe
qualityofPCBmountingandhighreliabilityofproducts,itisnecessarytoconduct
coplanaritydetectionofSMDbeforemounting.Thetraditionalmanualvisualdetection
methodhasthedisadvantagesoflowefficiency,unquantifiedprocessindexandweakprocess
guidance,soitcannotmeettherequirementsofhighefficiency,highreliabilityandhigh
precisiondetectionofSMDinthecurrentelectricalassemblyworkshop.Thispaperaimsto
studyasetofSMDcoplanaritydetectionsystembasedonmachinevision,andmainly
completesthefollowingwork:
(1)Throughtheinvestigationoftheapplicationintheelectricalassemblyworkshop,the
characteristicsofthepackagingtypeofsurfacemountdeviceswereanalyzed,andthe
coplanardetectionindexwasquantifiedaccordingtotherequirementsofprocessdefect
detection.
(2)Thispaperintroducesthecurrentresearchstatusofmainstreamcoplanaritydetection
technologies,analyzestheiradvantagesanddisadvantages,anddeterminesthecoplanarity
detectionsystembasedon3Dcamera.
(3)Thehardwarestructureandworkflowoftypicalmachinevisionsystemareanalyzed.
Bystudyingthecameraimagingprinciple,thecameraselectioniscompleted.Byanalyzing
theprincipleofSMDcoplanardetection,therealizationschemeofSMDcoplanardetectionis
determined,andthedetectionalgorithmmoduleisdesignedbyusingimageprocessing
technology.BasedonMicrosoftVisualStudiodevelopmentplatform,throughC#
developmentlanguageandOpenCV.NETpackagelibrary,thedevelopmentofdetection
algorithmeachmodule.FinallyrealizeSMDcoplanardefectdetectionfunction.
(4)Completethecalibrationofthecamera,t
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