包覆层熔体温度对7075_6061复合界面组织及硬度的影响.docxVIP

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第54卷 第7期2025年4月

热加工工艺

HotWorkingTechnology

ISSN1001-3814CN61-1133/TG

DOI:10.14158/j.cnki.1001-3814. rjggy@

包覆层熔体温度对7075/6061复合界面组织及硬度的影响

苏晓琳1,郑小平2,谢文杰2,郝梓煜1,张世旭1,牛梦娇1,韩玉雪2

(1.华北理工大学以升创新教育基地,河北唐山063210;2.华北理工大学冶金与能源学院,河北唐山063210)

摘要院利用固/液复合法制备了7075/6061双金属复合铸锭袁分析了包覆层6061铝合金熔体温度对复合界面组织尧成分与硬度的影响规律袁探讨了复合界面的冶金结合机制遥结果表明院剪切平台可有效去除内层7075铝合金半固态坯料的表层氧化物袁使得复合界面纯净无污染曰随着包覆层熔体温度的升高袁复合界面的Cu尧Mn尧Zn元素扩散距离逐渐增大袁界面宽度逐渐增大袁内层合金的半固态组织呈枝晶化演变趋势增强曰复合界面主要以熔体对流与原子扩散的协

同作用实现高效冶金结合遥

关键词院双金属复合材料曰固/液复合曰铝合金曰界面组织

中图分类号院TB331 文献标识码院A 文章编号院1001-3814(2025)07-0090-05

EffectsofCladdingMeltTemperatureonMicrostructureandHardnessof7075/6061CompoundInterface

SUXiaolin1,ZHENGXiaoping2,XIEWenjie2,HAOZiyu1,ZHANGShixu1,

NIUMengjiao1,HANYuxue2

(1.YishengCollege,NorthChinaUniversityofScienceandTechnology,Tangshan063210,China;2.CollegeofMetallurgyandEnergy,NorthChinaUniversityofScienceandTechnology,Tangshan063210,China)

Abstract院7075/6061bimetalcompositeingotwaspreparedbysolid/liquidcompoundmethod.Theinfluenceofthemelt

temperatureofcladding6061alloyonthemicrostructure,compositionandhardnessofthecompoundinterfacewasanalyzed,andthemetallurgicalbondingmechanismofthecompoundinterfacewasdiscussed.Theresultsshowthattheshearplatformcaneffectivelyremovethesurfaceoxideoftheinner7075alloysemi-solidbillet,sothatthecompoundinterfaceispureandpollution-free.Withtheincreaseofcladdingmelttemperature,thediffusiondistancesofCu,MnandZnelementsatthecompoundinterfacegraduallyincrease,andtheinterfacewidthgraduallyincreases,andthesemi-solidmicrostructureoftheinneralloyexhibitsanenhanceddendriticevolutiontrend.Theinterfacemainlyrealizesefficientmetallurgicalbondingbysynergisticeffectofmeltconvectionandatomicdiffusion.

Keywords院bimetalcompositematerials;