ZnO纳米颗粒对Cu(Mo)_Sn-3.0Ag-0.5Cu-xZnO焊点界面IMC生长行为的影响.docxVIP

HotWorkingTechnology2019,Vol.48,No.9

ZnO?????Cu（Mo）/Sn-3.0Ag-0.5Cu-xZnO????IMC???????

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??：??F4N??????0.5wt%?1.0wt%??ZnO??????Cu（Mo）/Sn-3.0Ag-0.5Cu???。?170℃?????????（0、48、96、144、192?240h）???????。??SEM???????????。?????????????，????????????????????。???????，0.5wt%ZnO???????????????（IMC）??1.0wt%ZnO?????????，??IMC???????ZnO????????，???5.44×10-18m2/s?8.03×10-18m2/s。???ZnO????????IMC??????。

???：????；ZnO????；????；IMC?DOI:10.14158/j.cnki.1001-3814.2019.09.006

?????：TG425 %%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%?????：A% ????：1001-3814(2019)09-0022-05

EffectofZnONano-particlesonInterfacialIMCGrowthBehaviorofCu（Mo）/Sn-3.0Ag-0.5Cu-xZnOSolderJoints

QUMin,CAOTianze,ZHENGZihao,CUIYan,LIUFengbin

(SchoolofMechanicalandMaterialsEngineering,NorthChinaUniversityofTechnologyBeijing,Beijing100144,China)Abstract：Cu(Mo)/Sn-3.0Ag-0.5CusolderjointswerepreparedbyusingF4Nrefluxfurnaceand0.5wt%and1.0wt%

ZnOnanocompositesolders.Isothermalagingtreatmentofsolderjointswascarriedoutfordifferenttime(0,48,96,144,192and240h)at170C.InterfacemorphologywasanalyzedbySEM.Theresultsshowthatwiththeincreaseofagingtime,theinterfacemorphologyevolvesfromintervalscallopshapetocontinuousscalloptype.Comparedwithintermetalliccompound(IMC)layerof1.0wt%ZnOnanocompositesolder,theIMClayerof0.5wt%ZnOnanocompositesolderisflatterunderthesameagingtime.ThediffusioncoefficientsofinterfacialIMClayerincreaseswiththeincreaseofcontentofZnO,whichare5.44×10-18m2/sand8.03×10-18m2/s,respectively.ThemechanismofinterfacialIMClayergrowthhinderedbyZnOnanoparticleshasbeenexplored.

Keywords：lead-freesolder;ZnOnano-particles;interfacemorphology;IMClayer

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