WB常用线型课件.pptVIP

STD—Standardloop(標准線形)應用﹕一般應用LoopbondingFirstbond:goldballbondSecondbond:Stitchbond

Flatloop—平台線形應用﹕針對長線(3mm)﹑堆疊線形時適用FlatMulti-layerwire

BallBump—置金球線形應用﹕類似于solderbump,適用于倒裝芯片Bumpbonding

SSB—Stand-offstitchbondStand-off:有支座的﹐有托腳的應用﹕適用于DietoDie(防止損傷die)﹑Dietosubstrate(陶瓷板﹑或laminate板等著線墊平整度較差時的應用)DieDie1Die2SubstrateSSB=Bumpbonding+Loopbonding1231Bumpbonding2loopbonding:goldballbond3loopbonding:stitchbond

RSSB—ReverseStand-offstitchbond應用﹕針對ultralowloop應用DieSubstrate弧高可控制在80um以下