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DARPA’sIntra/InterchipEnhancedCooling(ICECool)Program

AvramBar-Cohen¹,JosephJ.Maurer²,JonathanG.Felbinger²

DefenseAdvancedResearchProjectsAgency,675N.RandolphSt.,Arlington,VA22203,ABC@

BoozAllenHamilton,3811N.FairfaxDr.,Arlington,VA22203,Maurer_Joseph@

Keywords:thermalmanagement,nearjunction,intrachip,interchip,GaN,embeddedhighperformancecomputing

Abstract

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