YST 863-2025 计算机散热器用铜型材标准立项发展报告.docx

计算机散热器用铜型材标准立项发展报告

StandardizationDevelopmentReport:CopperProfilesforComputerHeatSinks

摘要

关键词：计算机散热器；铜型材；行业标准；散热性能；导热系数；有色金属

Abstract

Withtherapidadvancementofcloudcomputing,artificialintelligence,5Gcommunications,andhigh-performancecomputing(HPC),thethermaldesignpower(TDP)ofcomputerchipscontinuestorise,makingheatdissipationacriticalbottleneckconstrainingelectronicdeviceperformanceimprovementandoperationalreliability.Copperprofiles,owingtotheirexcellentthermalconductivity,arewidelyusedinthecoremanufacturingofcomputerheatsinks.H