半导体器件与工艺仿真技术.pptxVIP

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  • 2026-09-17 发布于北京
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EEE533:SemiconductorDeviceandProcessSimulationSpring2001Lecture2Instructor:DragicaVasileskaDepartmentofElectricalEngineeringArizonaStateUniversity

A.INTRODUCTIONModeling Representationofthephysicalstructureorbehaviorofadevicebyanabstractmathematicalmodelwhichapproximatesthisbehavior:closedformexpression(analyticalmodel),orasystemofsimultaneousequationsthataresolvednumerically.Analysis-methodbywhichacomplexproblemofcharacterizingthedeviceisresolvedintosimilarcomponentpartswhichallowtherequiredinvestigationtobeachievedin

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