NOKIA项目可行性报告英文.docVIP

Feasibility Report Nokia Corporation Oct.25th. 2011 Contents 一、Introduction 二、Technology 三、Market Environment 四、The industry in which the enterprise operates 五、 Business model 六、 Marketing and sales strategies 七、 Production/operating Requirements 八、Management and Personnel 九、Intellectual Property 十、Regulations/Environmental Issues Critical Risk Factors 十一、Summary 一、Introduction This business feasibility study will support the decision-making process as to whether the joint investment is in fact viable. This report is designed to dovetail in pursuit of efficiencies of development, evidentiary alignment and consistency of reporting. 二、Technology Surface mount technology (SMT) is a method for constructing electronic circuits in which the components (surface-mounted components/SMCs) are mounted directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component. Advantages The main advantages of SMT over the older through-hole technique are: Smaller components. Smallest is currently 0.2 x 0.1?mm (0.01?in x 0.005?in: 01005). Much higher number of components and many more connections per component. Fewer holes need to be drilled through abrasive boards. Simpler automated assembly. Small errors in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads). Components can be placed on both sides of the circuit board. Lower resistance and inductance at the connection (leading to better performance for high