PCB化学镍金ENIG板焊接不良和回流焊不良分析、区分——PCB测试手段综合运用实例探讨.pdfVIP

PCB化学镍金（ENIG）板焊接不良和回流焊不良的分析、区分 Distinguish between Defective Welding and Defective Reflow Soldering of ENIG PCB ——PCB测试手段综合运用实例探讨 Discussion on Synthetical Application of Testing Methods for PCB Fei Xiao 摘要: 微切片是电路板内部品质检查的一种常用手段。按 IPC-6012B 的说法是在 100 倍放大仔细观察 其画面品质，然后参考规格进行允收和判退。发生争议时用 200 倍的倍率进行仲裁。 但微切片的手法还可以针对 PCB 制程、PCB 失效机理、SMT 焊接失效机理等情况或研究发展的需 要进行深入观察，但这时常常需要放大 400-500倍甚至 1000倍。必要时还要辅以 X-RAY 荧光光谱仪、 扫描电镜(SEM)、X 射线能谱仪(EDX)等设备进行验证。否则单凭切片图片的说服力十分有限。 本文将从对化镍金板在 SMT 厂商处出现焊接不良的分析入手，通过微切片并辅以 X-RAY 荧光光 谱仪、扫描电镜(SEM)、X 射线能谱仪(EDX)等设备的综合运用，论证、区分 PCB 化镍金（ENIG）焊 接不良和回流焊不良问题（冷焊、虚焊等）。供大家参考。 Abstract: Micro slice is the common method to inspect the inner quality of PCB. According to the description of IPC-6012B, the PCB will be accepted or rejected based on the image quality under a 100X magnifier. For dispute resolution, a 200X magnifier should be adopted to judge the quality. But Micro slice can still be used for the further observation of PCB production process, malfunction mechanism of PCB, malfunction mechanism of SMT welding, etc. or the demand on research development, but here the slice should be magnified at 400 to 500 times, even 1000 times. If necessary, X-RAY fluorescence spectroscopy, SEM, EDX should be used to verify because it couldn’t prove too much only by a slice image. The article will start from the analysis of defective welding of ENIG PCB, which is made by the SMT manufacturer. With the synthetical use of X-RAY fluorescence spectroscopy, SEM, EDX and some other instruments, we can distinguish between defective welding and defective reflow soldering (cold solder, dry joint) of ENIG PCB for your reference. 关键词： 化镍金 EING 回流焊 reflow 焊接不良 defective welding 区分 distinguish 正文： 我首先简单介绍一下 PCB 化镍金工艺和 SMT 回流焊工艺，并