集成电力电子模块封装的关键技术.pdfVIP

第27 卷 第4 期 电 子 元 件 与 材 料 Vol.27 No.4 2008 年4 月 ELECTRONIC COMPONENTS AND MATERIALS Apr. 2008 综 述 集成电力电子模块封装的关键技术 1,2 2 王建冈 ，阮新波 （1. 盐城工学院 电气与信息工程学院，江苏 盐城 224051；2. 南京航空航天大学 自动化学院，江苏 南京 210016） 摘要: 封装技术直接影响到集成电力电子模块(Integrated Power Electronics Module ，IPEM)的电气性能、EMI 特性 和热性能等，被公认为未来电力电子技术发展的核心推动力。介绍了 IPEM 封装的结构与互连和基板技术等关键技术 及研究现状，分析了已存在的薄膜覆盖封装技术等三维 IPEM 封装技术，讨论了 IPEM 封装的发展趋势，最后指出我 国IPEM 封装技术研究的限制因素与对策。 关键词: 电子技术；封装；综述；集成电力电子模块；互连技术 中图分类号: TN40 文献标识码:A 文章编号:1001-2028 （2008 ）04-0001-05 Key technologies for packaging of integrated power electronics module WANG Jian-gang1,2, RUAN Xin-bo2 (1. College of Electrical and Information Engineering, Yancheng Institute of Technology, Yancheng 224051, Jiangsu Province, China; 2. College of Automation Engineering, Nanjing University of Aeronautics Astronautics, Nanjing 210016, China) Abstract: The package technology, which impacts on electrical, EMI and thermal characteristics of integrated power electronics module (IPEM), is considered as a central driver in future power electronics technology. The key technologies of IPEM packaging such as structure and interconnecting technology, substrate technology were introduced and the existing three-dimensional packaging technologies for IPEM were analyzed and compared. The developmentae trends of IPEM packaging were discussed. The limiting factors and the corresponding countermeasures of researches on IPEM packaging in our country were pointed out finally. Key words: electron technology; packaging;