MEMS器件封装的低温玻璃浆料键合工艺研究.pdfVIP

Techn l gy C lumn d i: 103969/ jissn1003-353x200912006 MEMS 1, 2 1 2 虞国平 , 王明湘, 俞国庆 ( 1苏州大学 电子信息学院, 江苏 苏州215021; 2晶方半导体科技 ( 苏州) 有限公司, 江苏 苏州215126) : 玻璃浆料是一种常用于MEMS 器件封装的密封材料系统研究了MEMS 器件在低温下 使用玻璃浆料键合硅和玻璃的 程与大多数MEMS 器件采用的玻璃浆料相比 ( 烧结温度400 以上) , 此工艺 ( 烧结温度350 ) 在键合完成后所形成的封装结构同样具有较高的剪切强度 ( 封装器件剪切强度大于360 kPa) , 同时具有较好的气密性 ( 合格率达到933% ) , 漏率测试结果 符合相关标准结果表明, 在保证MEMS 器件封装剪切强度和气密性的同时, 降低键合温度条件 是可以实现的 : 微机电系统; 气密封装; 玻璃浆料键合; 低温; 圆片级封装 : TN30594 : A : 1003-353X ( 2009) 12- 1173-04 Study on Low Temperature Glass Frit Bonding for MEMS Device 1,2 1 2 Yu Gu ping , Wang Mingxiang , Yu Gu qing ( 1School of Electronic and Inf ormation, Soochow University , Suzhou 215021, China; 2China Waf er Level CSP Ltd. , Suzhou 215126, China Abstract: Glass frit is a kind f sealing material f r MEMS device. The b nding pr cess f Si and glass f r MEMS device at l w-temperature with glass frit were studied. C mpared t the glass frit f r m st MEMS devices ( sintering temperature is ab ve 400 ) , the package structure f rmed after b nding ( sintering temperature is 350 ) by the new pr cess has higher shear strength ( 360 kPa) , and better sealing (yield is up t 933%) . The leak rate fits the relative standard. The results sh w that b th shear strength and leak rate are enc uraging. It is pr ved that the MEMS package can be hermetically sealed at the l w temperature f 350 . ey words: MEM