铜系材料注射成形研究进展.pdfVIP

/ 85 * , , , , , , , ( , 650106) 微电子行业的迅速兴起, 对铜系材料提出了更高的要求铜系材料部件的小型化复杂化使得 属粉 末注射成形工艺得到了越来越广泛的重视介绍了 属粉末注射成形工艺及其应用, 从纯铜铜合 铜复合材料3 个方面阐述了 属粉末注射成形工艺的国内外发展近况 Research Progress of Metal Injection Molding in Copperbased Materials IU Manmen, IU Jie, XIE Ming, YANG Youcai, CHEN Yongtai, CUI H ao, ZHANG Jiming, CHEN Hongyan ( Kunming Institute of Precious M et als, Kunming 650106) Abstract As the rapid rise of the microelectronics industry, higher requirement s are put forward for t he cop perbased materials. The process of metal injection molding(M IM) is gaining increasing att ention because of the more and more small and complex of the copperbased materials parts. T he process and application of metal injection mol ding are introduced, then the research status and progress of metal injection molding are reviewed in the sequence of pure copper, copper alloys and copper composites. Key words metal injection molding, pure copper, copper alloy, copper composites [8] 10m 0 , ( ) , , 75% , ,, , , 900 [ 1] , , 95% 80% , [ 2, 3] , , [9] , 1 , 74m , [ 4- 7] 10m , , CuW CuMo , , , , , 1. 1