厚铜多层印制板工程设计与生产控制.pdfVIP

特种印制板 Special PCB 印制电路信息 2013 No.4 厚铜多层印制板的工程设计与生产控制 Paper Code: S-011 柯 勇 谭小林 张柏勇 胡定益 （景旺电子科技（龙川）有限公司，广东 河源 517373） 摘 要 文章分析了厚铜多层印制板的主要制作难点，如内外层厚铜线路制作、厚铜多层印制 板压合、厚铜多层印制板钻孔、厚铜多层印制板阻焊印刷等。针对主要制作难点，文 章介绍了如何从板材和半固化片选用，压合叠层结构优化，内层线路图形设计补偿， 钻孔设计，阻焊设计等工程设计手段来提高产品可靠性，以及介绍了重要制作工序的 生产控制要点，有效提高了厚铜多层印制板的品质可靠性。 关键词 厚铜多层印制板；工程设计优化；生产控制要点；制作难点 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2014）04-0126-08 Thick copper multilayer PCB engineering and production control KE Yong TAN Xiao-lin ZHANG Bo-yong HU Ding-yi Abstract This paper mainly analyzed lots difficulties to fabrication heavy copper multilayer printed board, such as inner and outer layer circuit transfer, pressing, drilling, solder mask printing. Face to above mentioned lots of difficulties, this article described how to select CCL and Prepreg, how to Optimum design of lay up structure, how to compensate and design inner layer circuit, how to select suit drill size, and how to design solder mask opening etc engineers design methods to improve heavy copper board quality reliability, And also described some critical control points of the production process, Effectively improve multilayer heavy copper board quality reliability. Key words Multilayer Heavy Copper Board; Engineering Design Optimum; Production Control Points; Fabrication Difficulties 1 前言 前景。 随着国内3G行业的继续扩展，智能手机、