碳泡沫导热性能及力学性能研究.pdfVIP

23 6 Vol. 23, No. 6 2008 11 Journal of Inorganic Materials Nov., 2008 : 1000-324X(2008)06-1171-04 ( / 710072) ◦ Ar  1000 C ◦ 2000 C Æ 3 Æ 0.50g/cm , c 1.007W/m·K, 8.82MPa i ÆÆ n TB322 A a Research on Thermal Conduction and Mechanical Properties for Carbon Foam g r TIAN Zhuo, LI Ke-Zhi, LI He-Jun, SHI Zhen-Hai o (C/C Composites Technology Research Center, Northwestern Polytechnical University, Xi’an 710072, China) n Abstract: The phenolic resin foam was prepared by using hollow phenolic resin microspher which was I s l ◦ made by microcapsule. And under the protection of Ar, the microcapsules were carbonized at 1000 C ◦ and graphited at 2000 C, then the foam was got. Herein the porosity and the effect of heat treatment f a i temperature on carbon foam were investigated. And the results show that the porosity increasement o r can reduce the thermal conduction of material, and the low thermal conduction