细间距器件无铅焊点可靠性的数值模拟和试验研究.pdfVIP

2008 2008 10 , 210016 : Ananad Garofalo-Ahrrhenius SnAgCu Ananad Garofalo-Ahrrhenius Anand Engelmaier Coffin- Mason Garofalo-Ahrrhenius : : TG454 : A Reliability of fine pitch devices with lead-free soldered joints by numerical simu lation and experiments ZHANG Liang XUE Song-bai , GAO Li-li, HAN Zong-jie, SHENG Zhong College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China Abstract : The lead free soldered joints were selected as the object of study for the joining technology of aviation electronic devices. This paper presents the fatigue life of fine pitch devices with SnAgCu soldered joints calculated by numerical simulation and experiments, based on two sorts of constitutive models: Anand equation and Garofalo- Ahrrhenius equation, and three life prediction models. It was found that the similar tendency can be seen in the stress history course curves based on both constitutive models, and the value of stress based on Anand equation was lager than that based on Garofalo- Ahrrhenius equation. Three life prediction equations with thermal cycling experiments were implemented to analyze the fatigue life of fine pitch devices with SnAgCu soldered joints under thermal cycling test, the fatigue life, estimated by Coffin- Mason model based on Anand equation is closer to the test data than that according to equivalent accumulated creep strain and accumulated creep strain energy density based on Garofalo- Ahrrhenius equation, therefore, the fatigue life prediction equations based on equivalent accumulated c