铜尺寸对引发化学镀的影响.pdfVIP

Size Effect of Copper Upon Electroless Initiation Hu Guanghui, Pan Zhanchang Faculty of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou (510006) Abstract It is found that small isolated copper discs(0.1mm) are more difficult to initiate electroless nickel plating than larger size copper discs(0.1mm). That is, “skip plating” is easy to take place on small sized copper pad. The main reason might be the different rate of conversion of palladium (Pd(s)), which can be obtained by exchange reaction between palladium ion and copper pad. For the “skip plating” caused by the covering effect, it is related to the balance of electrochemical potential. The electron transportation happens in the activation process, Which mainly determines the “skip plating” happens or not. Keywords: skip plating, electroless nickel plating, size effect, covering effect 1. Introduction Electroless nickel–phosphorous (EN) deposition is one of the most important production techniques because of its excellent corrosion pretection, hardness, wear resistance and so on[1-4]. Thus it is widely used in many aspects of the electronic and other industries. For example, electroless nickel may be utilized as a barrier layer material [5], wirebond substrate [6]. Electroless nickel protection of copper is common in PCB manufacturing, because it is the most effective barrier to Cu/Au interdiffusion[7]. In electroless deposition, the activation step is a key factor in controlling the rate and mechanism of elect