Basicthermalrisistance(热阻测试).pdfVIP

Thermal Management August 2002 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL prod- ucts, however, high-density PLDs often require consideration of thermal issues as part of any sound design meth- odology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature of 150°C for all devices excluding the 320-ball BGA and 432-ball BGA, which specify a maximum allowable junction temperature of 140°C. The system designer should always complete a thermal analysis of their specific design to ensure that this temperature is not exceeded. In addition to the device and package, the thermal characteristics of a circuit depend on the operating temperature, device power consumption, and the ability of the system to dissipate heat. The maximum junction temperature of a device can be calculated as shown: T = T + Power*θ J A JA or T = T + Power *θ J C JC Where : TJ = Junction Temperature of the Device T = Ambient Temperature A TC = Case Temperature θ = Junction-to-Ambient Thermal Resistance (see table at the end of this section) JA θ = Junction-to-Case Thermal Resistance (see table at the end of this section) JC Power = ICC * VCC ICC may be estimated as shown in the “Power Consumption” section of the individual data sheets. The parameters in the Icc equation may be found in the report file from the ispLEVER™ compiler. If the calculated T max exceeds 150°C (140°C for the 320-ball BGA and 432-ball BGA; 130˚C for MACH devices), J refer to the following hints to reduce overall power dissipation and package temperature. Ways to Reduce Junction Temperature 1. Increase air flow in the sy