双孢菇的发生健康和感染Lecanicilliumfungicola的酚氧化酶和热休克蛋白基因的表达.pdfVIP

Appl Microbiol Biotechnol (2010) 85:1499– 1507 DOI 10.1007/s00253-009-2186-2 APPLIED GENETICS AND MOLECULAR BIOTECHNOLOGY Expression of phenol oxidase and heat-shock genes during the development of Agaricus bisporus fruiting bodies, healthy and infected by Lecanicillium fungicola Michèle L. Largeteau Camille Latapy Nathalie Minvielle Catherine Regnault-Roger Jean-Michel Savoie Received: 29 April 2009 /Revised: 3 August 2009 /Accepted: 4 August 2009 /Published online: 27 August 2009 # Springer-Verlag 2009 Abstract The fungal pathogen Lecanicillium fungicola Keywords Fungal pathogen . Mushroom . (formerly Verticillium fungicola) is responsible for severe Gene expression . HSP70 . Laccase . Tyrosinase losses worldwide in the mushroom (Agaricus bisporus) industry. Infected crops are characterised by masses of undifferentiated tissue (bubbles) growing in place of spor- Introduction ophores. The expression of three laccase genes (lcc1, lcc2 and lcc3), two tyrosinase genes (AbPPO1 and AbPPO2) and Dry bubble disease is the most common and serious fungal the hspA gene encoding a heat-shock protein known to be disease of Agaricus bisporus . The causal agent, commonly potentially associated with host–pathogen interaction was known as Verticillium fungicola (Preuss) Hassebrauk, was investigated in mycelial aggregates and during the develop- recently renamed as Lecanicillium fungicola (Preuss) Zare ment of healthy sporophores and bubbles of a susceptible and Gams (Zare and Gams 2008). L. fungicola infection is cultivar. The lcc3, AbPPO2 and hspA genes were each manifested in three types of symptoms designed spotty cap, expressed at different levels at the different stages of stipe blowout and bubble. Although the three types of sporophore morphogenesis, whilst