Au80Sn20合金焊料的制备及应用研究进展.pdfVIP

Au80Sn20合金焊料的制备及应用研究进展／刘文胜等 · 1 · Au80Sn20合金焊料的制备及应用研究进展* 刘文胜，黄宇峰，马运柱 (中南大学粉末冶金国家重点实验室，长沙410083) 摘要 含有80％金和20％锡(质量分数)的Au80S1120合金焊料因其高熔点及免助焊剂等性能而被广泛应用 于光电子封装和微电子封装领域。综述了Au80Sn20合金焊料的性能，分析了金锡叠层法、熔铸法、电镀沉积法和机 装等领域的焊接技术和应用情况，最后指出了Au80Sn20合金焊料的研究方向和应用前景。 关键词 Au80sn20合金焊料微电子封装光电子封装界面反应制备技术 中图分类号：TN305．94 文献标识码：A Au80Sn20Solder Research in and of PreparationApplication Alloy Progress LIU Yunzhu Yufeng，MA Wensheng，HUANG forPowder South 410083) (StateLaboratory University，Changsh Key Metallurgy，Central Au80Sn20solder 80 and20 is usedintheareasof AbstractThe wt％tin alloycontainingwt％gold widely op— toelectronicandmicroelectronicduetoits andother packaging packaging highmeltingpoint，free—fluxproperties．The are thetechnical andcharacteristicsofthemethodsto ofAu80S；n20solder surrlmarized，and properties aUoy principle Au80Sn20solder mechanicalallo— prepare alloyby901小tinlamimting，meltillg_casting，electroplatingdeposition，and arealso The and ofAu80Sn20solderinthefieldsof ying analyzed．weldingtechnologiesapplications alloy gassealing andtube areintroduced．Theresearchdirectionsand of cover，shen chip applicationprospects