HDI板高厚径比微盲孔跨层微导通孔技术开发.pdfVIP

HDI板 HDI Boards 印制电路信息 2013 No.4 HDI板高厚径比微盲孔跨层 微导通孔技术开发 Paper Code: S-006 吴军权 刘继承 陈 春 黄建航 （惠州市金百泽电路科技有限公司，广东 惠州 516083） （深圳市金百泽电路科技股份有限公司，广东 深圳 518000） 摘 要 高厚径比微盲孔的HDI板制作通常需要很好的孔金属化能力保障其导通可靠性，但所 需生产设备及其配套成本让不少厂商望而却步。本文所述高厚径比微盲孔跨层微导通 孔（skip-μvia）技术，通过定位精度控制、激光钻孔参数调整以及制板流程优化等 工艺的开发，能以更低的成本、更高的品质、更短的加工流程以及常规孔金属化设备 实现高厚径比的微盲孔制造，从而降低了高厚径比微盲孔HDI板制造的难度。 关键词 高厚径比；微盲孔；跨层微导通孔 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2014）04-0178-05 Research on the techniques of skip-μvia with high aspect ratio micro-blind hole on HDI board WU Jun-quan LIU Ji-cheng CHEN Chun HUANG Jian-hang Abstract The micro-blind hole production with high aspect ratio usually requires a strong capability of hole metallization to ensure its connected reliability, but the cost of the necessary equipment and supporting was very expensive for many manufacturers. Herein the techniques of skip-μvia with high aspect ratio micro-blind hold, we can achieve the manufacturing of high aspect ratio micro-blind hole with lower cost, higher quality, shorter machining processes and conventional hole metallization equipment ,through techniques research of positioning precision control,laser-drill parameter adjustment and manufacturing process optimization.Then the manufacturing difficulty of HDI board with high aspect ratio micro-blind hold can be reduced. Key words High Aspect Ratio; Micro Blind Hold; Skip-μvia 1 前言