单片机仿真器毕业论文外文翻译.doc

First, the development of simulator Throughout nearly two decades of national development process of simulation technology, according to simulator technology to be used to divide the domestic about the design of simulators can be divided into the following periods: (1) the late 70s in the mid -80 The technology during this period was mainly the development of simulation systems, now is not high technology, the user request is not high. (2) the late 80s during the late -90 The main use of this period with an emulation function Winbond chip production, the technology is called Bondout. Using this chip to greatly simplify the design of emulator, so the standard of domestic emulator with a large increase can be largely occupied by the user resources. Simulation performance is due to the increase in domestic production in the emulator nearly 10 years no progress has been produced using this model. Although individual companies have also tried other techniques to improve the simulation of the standard, for example, HOOKS technology, but because of their technical limitations did not succeed. Instead abroad earlier simulator technology used HOOKS, HOOKS at the initial stage due to the complexity of the technology itself, simulation performance and price as the domestic use of the simulator Bondout. With the development of IC technology, the domestic production HOOKS technology is ripe, but several major domestic manufacturers also Bondout technologies intoxicated. (3)After 2000 year China in 2000 emulator period changes in the market, the largest, the most striking change is the Winbond W78958 chip simulation of the production. Winbond W78958 chip during the design stage, the internal functions of the simulation only to the production simulator to simulator manufacturers in order to better promote the W78958. After several years of change, however, W78958 simulator evolved into the use of a simulation of the ASIC rather than using the standard chip, the scope o