一种堆叠式3DIC最小边界热分析方法_余慧.pdfVIP

5 V l .40 N . 5 2012 5 ACTA ELECTRONICA SINICA May 2012 3D IC 余 慧, 吴 昊, 陈更生, 童家榕 ( , 200433) : , ( 3D IC) , , . 3D IC , ; , 3D IC , . : , 3D IC, ; 90% . : ; ; 3D IC; : TN401 : A : 0372-2112 ( 2012) 05-0865-06 URL: http: / / www. ej urnal. rg. cn DOI : 10. 3969/ j. issn. 0372-2112. 2012. 05. 001 A Minimal Boundary Thermal Analysis Method for Stacked 3D IC YU Hui,WU Ha , CHEN Geng-sheng, TONG Jia-r ng (ASI C and System State K ey laborat ory, Fudan University, Shanghai 200433, China) Abstract : Current thermal analysis t ls can nly efficiently handle 3D integrated circuits with simple structure. T deal with m re c mplicated stacked 3D integrated circuits, m re c mplex, and err r-pr ne b undary c nditi ns need t be set up. In this pa- per, we pr p se simple, yet efficient meth d, called minimal b undary meth d, t handle the c mplicated b undary c nditi ns by transf rming the 3D stacked structure t a structure with simple b undary ( thus f r easy b undary c nditi n set up) . T b st the thermal analysis via iterative c njugate gradient meth d, we c nstruct a n vel prec nditi ner, which c nsists f the thermal c nduct r matrices f the building bl cks f the stacked 3D structure as its diag nal bl cks. Experimental results sh w that by using finite ele- ment meth d al ng with the pr p sed minimal b undary pre-pr cessing , we can btain accurate thermal analysis results. The pr - p sed prec nditi ner can reduce the 90% iterati ns in the c njugate gradient meth d. Key words: thermal analysis; the finite element meth d; 3D IC; the minimal b undary 3D IC . 1