《Development of high-performance optical silicone》.pdf

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 33, NO. 4, DECEMBER 2010 761 Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs Yeong-Her Lin, Jiun Pyng You, Yuan-Chang Lin, Nguyen T. Tran, and Frank G. Shi Abstract —Silicone materials with a relatively high-refractive it protects the device from dust and moisture. Second, it index have been introduced for the encapsulation of high- behaves as a lens focusing the light in the desired way. Third, power light-emitting diodes (LEDs), and LEDs with relatively it improves the light output of LED device by increasing short wavelengths. However, most of those existing silicone encapsulants still suffer from thermal and radiation induced light-extraction from LED chip to air. A major challenge degradations and thus lead to reliability issues and a shorten for the LED encapsulant is to achieve high-light-extraction lifetime. A new high-performance silicone has been developed efficiency, especially for high-power LED in general illumina- and its performance is compared with other commercial silicone tion applications. Due to the relatively low-refractive index and optical grade epoxy in high-power white LEDs. The new (RI) of the encapsulant that results in a low-critical angle materials had been found to suffer less loss in the lumen output during the aging test and high-temperature/high-humidity test, as at encapsulant-chip interface, there is a relatively high-light- well as the Joint Electron Devices Engineering Council (JEDEC) extraction between the LED chip and the encapsulant wit