UNIT-VI-AboutSNISTUtilities.pptVIP

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UNIT-VI-AboutSNISTUtilities.ppt

Tool geometry elements of an 18-tooth plain milling cutter. MILLING OPERATIONS :- Pockets chamfering FLAT SURFACES GRINDING MACHINE :- GRINDING MACHINE :- ABRASIVE PROCESSES Abrasive machining involves material removal by the action of hard, abrasive particles that are usually in the form of a bonded wheel. Grinding is the most important abrasive process. Other traditional abrasive processes include honing, lapping, super finishing, polishing, and buffing. The abrasive machining processes are generally used as finishing operations They can be used on all types of materials ranging from soft metals to hardened steels and hard non metallic materials such as ceramics and silicon. Some of these processes can produce extremely fine surface finishes, to 0.025 μm. For certain abrasive processes, dimensions can be held to extremely close tolerances. GRINDING Grinding is a material removal process accomplished by abrasive particles that are contained in a bonded grinding wheel rotating at very high surface speeds. The grinding wheel is usually disk-shaped, and is precisely balanced for high rotational speeds. A grinding wheel consists of abrasive particles and bonding material. The bonding material holds the particles in place and establishes the shape and structure of the wheel. The projected abrasive particles act like cutting tool tips and remove metal. Cutting edge becomes dulled and eventually get cracked. This process continues till the abrasive grains get worn out till the level of bond Bond allows the remainder of the worn grains to be torn from the wheel exposing new grains. WORKING PRINCIPLE OF GRINDING A grinding wheel consists of abrasive particles, bonding material and voids. The projecting abrasive particles acts like cutting tool tips and remove metal where a properly selected grinding wheel exhibits self-sharpening action. As cutting proceeds, the abrasive particles at cutting edge become cracked along the cleavage planes due to resistance offered by w

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