Investigationoflasermicrodrillingforsiliconwafersubstrate.docVIP

Investigation of laser micro-drilling for silicon wafer substrate M.F. Chen*, W.T. Hsiao*, Y.S. Ho*, K.C. Huang**, S.F. Tseng**, Y.P. Chen*** * Department of Mechatronics Engineering, National Changhua University of Education, Taiwan ** Instrumentation Engineering Division, Instrument Technology Research Center, Taiwan ***PCB Department, Tongtai Machine Tool CO., LTD, Taiwan Abstract: Brittle materials are widely used in semiconductor and photoelectron components, such as glass, ceramic, silicon wafer, sapphire and etc. Laser processing of brittle materials is an important technique including micro-drilling, scribing, cutting and microstructures. However, the traditional processing for material removal with mechanical processing or chemical wet etching that usually accompany many problems in the processing procedure consists of long time for and high cost of manufacturing equipments. In this research, the second harmonic generator (SHG) and third harmonic generator (THG) Nd:YAG laser microvia is utilized on silicon wafer. Moreover, optical microscope (OM), scanning electron microscope (SEM) and surface finish and form measurement have been used for micro-drilling characterization measurement such as morphological of drilling profile, taper and melted residual of the hole. Finally, the proportion of diameters and depths for various parameters including laser power, pulse repetition rate and machining time are determine. Keywords: brittle material, micro-drilling, surface profile, residual 1. Introduction Recenly, laser micro technologies are developing and widely used in industries. Laser materials processing is composed of laser cutting, drilling, marking, scribing, laser modification of material surface, laser annealing and laser trimming with regard to the brittle materials including silicon wafer, quartz, sapphire substrate, and glass structure. Silicon wafer is the most common material for Micro-Electro-Mechanical Systems (MEMS), photonics and semiconductor