PN-4621-ElectronicComponentsResourceCentral.docVIP

ANSI/EIA STANDARD STANDARD TEST METHOD FOR DESTRUCTIVE PHYSICAL ANALYSIS (DPA) OF CERAMIC MONOLITHIC CAPACITORS ANSI/EIA-469-E DRAFT APRIL 2002 ELECTRONIC COMPONENTS, ASSEMBLIES MATERIALS ASSOCIATION The Electronic Component Sector Of Electronic Industries Alliance CONTENTS  Page Foreword Clause 1 Scope 1 2 Intent 1 3 Ceramic capacitor DPA terminology 1 4 Recommended procedures and methods 6 5 Microscopic evaluation of polished DPA samples 13 Table 1 Epoxy resin and hardener 9 2 Grinding schedule 10 3 Recommended schedule of material removed 11 4 Vibratory polishing procedure 12 5 Manual polishing steps 12 6 Side margins 14 7 End margins 14 8 Cover plate thickness 14 Annex A General inspection aids and visual inspection of decapsulated capacitors B Visual inspection of supplementary samples C Sample orientation and mounting D Internal defects and their measurement E Sample DPA report forms   Foreword This Standard was prepared under the cognizance of the P-2.1 Engineering Subcommittee on Ceramic and Mica Dielectric Capacitors of the Electronic Components, Assemblies Materials Association (ECA), the electronic component sector of Electronic Industries Alliance (EIA). This document provides terminology, methods, and criteria for characterizing the internal structural features of monolithic, ceramic dielectric capacitors. Its major objective is the accurate evaluation of the internal physical quality of the chip capacitor element as it relates to the functional reliability of the finished capacitor. This Standard also provides needed and useful information pertaining to activities associated with destructive physical analysis, such as post-decapsulation visual inspection and destructive physical analysis reporting. In addition, it provides tutorial help for problems inherent in destructive physical analysis sample processing. 1 Scope This document provides termino