Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers.pdfVIP

RARE METALS Vo1．30,No．4，Aug2011，P．381 DoI：10．1007~12598-011-0400-8 EffectofmechanicalanisotropyonmaterialremovalrateandsurfacequaUty duringpolishingCdZnTewafers 。 LIYan，JIEW anqia,KANG RenkebandGAOHnagb ， StateKeylaboratoryofSolidificationProcessing,NorthwesternPolytechnicalUniversity,Xi’an710072，China KeyLaboratoryforPrecisionandNon．TraditionalMachiningTechnology(MinistryofEducationofChina)，DalianUniversityofTechnology,Dalian116024,China Received26September2010；rceeivedinrevisedform 12November